Invention Grant
- Patent Title: Pressure-sensitive adhesive tape
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Application No.: US16633837Application Date: 2018-07-24
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Publication No.: US11186750B2Publication Date: 2021-11-30
- Inventor: Yusuke Yamanari , Makoto Saito , Naoaki Higuchi , Kenta Jozuka
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2017-192819 20171002,JPJP2018-104828 20180531
- International Application: PCT/JP2018/027688 WO 20180724
- International Announcement: WO2019/069541 WO 20190411
- Main IPC: C09J7/22
- IPC: C09J7/22 ; C09J131/04 ; C09J7/38 ; C09J133/08 ; C09J133/10
Abstract:
Provided is a pressure-sensitive adhesive tape excellent in unevenness followability. The pressure-sensitive adhesive tape of the present invention includes: a base material layer; and a pressure-sensitive adhesive layer arranged on at least one side of the base material layer, wherein the pressure-sensitive adhesive tape has a dimensional change ratio at 23° C. of from 0.20 to 0.39.
Public/Granted literature
- US20200165489A1 PRESSURE-SENSITIVE ADHESIVE TAPE Public/Granted day:2020-05-28
Information query
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