公开(公告)号：US11236253B2

公开(公告)日：2022-02-01

申请号：US15862989

申请日：2018-01-05

Applicant: NITTO DENKO CORPORATION

Inventor： Yusuke Yamanari ,  Makoto Saito ,  Naoaki Higuchi ,  Kenta Jozuka

IPC: C09J7/38 ,  C09J7/25 ,  C09J133/14 ,  C09J133/06 ,  C09J7/20 ,  C09J133/00 ,  C08L93/04 ,  C09J7/22

Abstract: Provided is a PSA sheet highly durable against repeated deformation and suited for use in a flexible device as well. The PSA sheet provided by this invention comprises a PSA layer. The PSA sheet shows a recovery rate at 100% elongation of 70% or higher. The PSA layer shows a displacement of 0.5 mm or greater according to the following holding power test:

At 23° C., the PSA layer is applied over a 10 mm wide by 20 mm long bonding area to a Bakelite plate as an adherend; a 1 kg load is applied in the length direction; after one hour, the displacement from the initial position where first applied is determined.

公开(公告)号：US11434341B2

公开(公告)日：2022-09-06

申请号：US16638340

申请日：2018-08-07

Applicant: NITTO DENKO CORPORATION

Inventor： Yusuke Yamanari ,  Makoto Saito ,  Akira Hirao ,  Kenji Furuta

IPC: C08J9/00 ,  C09J7/38 ,  C09J7/26 ,  C08J9/10 ,  C08J9/12 ,  C09J11/04

Abstract: A resin sheet with a pressure-sensitive adhesive layer including the resin sheet. The resin sheet including a main surface A and a main surface B opposite to each other across a thickness “d”, where the resin sheet has a 50% compression load of 20 N/cm2 or less at 23±5° C. in a direction of the thickness “d”, which is measured in conformity with a method of measuring a compression hardness described in JIS K 6767:1999; where the resin sheet has a Poisson's ratio at 23° C. of 0.10 or less; and the resin sheet has a thickness recovery ratio of 40% or more when compressed by 20% in the direction of the thickness “d” at 23° C.

公开(公告)号：US11186750B2

公开(公告)日：2021-11-30

申请号：US16633837

申请日：2018-07-24

Applicant: NITTO DENKO CORPORATION

Inventor： Yusuke Yamanari ,  Makoto Saito ,  Naoaki Higuchi ,  Kenta Jozuka

IPC: C09J7/22 ,  C09J131/04 ,  C09J7/38 ,  C09J133/08 ,  C09J133/10

Abstract: Provided is a pressure-sensitive adhesive tape excellent in unevenness followability. The pressure-sensitive adhesive tape of the present invention includes: a base material layer; and a pressure-sensitive adhesive layer arranged on at least one side of the base material layer, wherein the pressure-sensitive adhesive tape has a dimensional change ratio at 23° C. of from 0.20 to 0.39.

公开(公告)号：US20150174865A1

公开(公告)日：2015-06-25

申请号：US14402787

申请日：2013-07-22

Applicant: NITTO DENKO CORPORATION

Inventor： Itsuhiro Hatanaka ,  Yusuke Yamanari

IPC: B32B27/06 ,  B32B27/32 ,  B32B5/18

CPC classification number: B32B27/065 ,  B32B5/18 ,  B32B7/02 ,  B32B7/12 ,  B32B27/32 ,  B32B2250/02 ,  B32B2307/30 ,  B32B2307/304 ,  B32B2307/538 ,  B32B2307/56 ,  B32B2307/71 ,  B32B2307/72 ,  B32B2307/7265 ,  B32B2307/732 ,  B32B2439/70 ,  B32B2457/00 ,  B32B2457/202 ,  Y10T428/24355

Abstract: A repeelable foam laminate for use of an electronic device has a structure in which a layer containing a polyolefin-based resin is laminated to at least one surface of a foam layer, and surface roughness Sa of the layer containing a polyolefin-based resin is no more than 10 micrometers.

Abstract translation: 用于电子器件的可重复发泡层压板具有将含有聚烯烃类树脂的层层叠在发泡层的至少一个面上的结构，含有聚烯烃系树脂的层的表面粗糙度Sa为 超过10微米。