- Patent Title: Holding arrangement for holding a substrate, carrier including the holding arrangement, processing system employing the carrier, and method for releasing a substrate from a holding arrangement
-
Application No.: US15766335Application Date: 2016-11-10
-
Publication No.: US11186906B2Publication Date: 2021-11-30
- Inventor: Simon Lau
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- International Application: PCT/EP2016/077325 WO 20161110
- International Announcement: WO2018/086698 WO 20180517
- Main IPC: C23C14/50
- IPC: C23C14/50 ; C23C16/458 ; H01J37/32 ; H01L21/67 ; H01L21/673 ; H01L21/687 ; H01L21/683
Abstract:
A holding arrangement for holding a substrate is described. The holding arrangement includes a body having a first wall of flexible material; an adhesive arrangement configured for attaching the substrate, wherein the adhesive arrangement is provided on a first side of the first wall, and a force transmission arrangement configured for applying a force to a second side of the first wall opposing the first side of the first wall.
Public/Granted literature
Information query
IPC分类:
