A backlight module having a surface light source, a liquid crystal display panel, and a welding method of a light-emitting diode chip are provided. The backlight module having a surface light source including: a first pad and a second pad disposed on a substrate; a plurality of pad holes disposed in the first pad and the second pad; a magnetic film layer disposed in the plurality of pad holes; a solder paste disposed both on the first pad and the second pad; a light-emitting diode chip, wherein a plurality of pins disposed on two sides of the light-emitting diode chip are absorbed on the magnetic film layer and are connected to both the first pad and the second pad respectively by the solder paste.