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公开(公告)号：US12044925B2
公开(公告)日：2024-07-23
申请号：US17635896
申请日：2022-01-26
发明人： Yong Yang , Fancheng Liu , Guowei Zha
IPC分类号： G02F1/13357
CPC分类号： G02F1/133605 , G02F1/133603 , G02F1/133606
摘要： The present application discloses a display backplane and a display device. The display backplane includes a plurality of light-emitting sub-areas; each of the light-emitting sub-areas is provided with at least two light-emitting portions; a first light-guiding portion is arranged in each of the light-emitting sub-areas and is located between the at least two light-emitting portions, and a side of the first light-guiding portion close to the light-emitting elements has a second light-reflecting surface, and an orthographic projection of a portion of a side of the first light-guiding portion away from the substrate on the substrate falls within an orthographic projection of a portion of a side of the first light-guiding portion close to the substrate on the substrate.
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公开(公告)号：US11417795B2
公开(公告)日：2022-08-16
申请号：US16638480
申请日：2019-06-17
发明人： Yong Yang
摘要： A die-bonding method and a spraying device for an LED include: providing a substrate provided with a pad and a white oil layer covering wiring, placing a steel mesh on the substrate, and then spraying suspension containing solder paste on the pad by the spraying device, to form a solder paste film layer. Finally, a reflow process for the solder is performed. The solder paste is prepared on the pad by spraying, so that a crystal wafer is prevented from being tilted or short-circuited due to pulling or dragging of the solder paste during the reflow process for the solder, thereby improving uneven brightness of the surface light source.
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公开(公告)号：US20220004056A1
公开(公告)日：2022-01-06
申请号：US16637843
申请日：2019-09-17
发明人： Yong Yang
IPC分类号： G02F1/13357 , G02F1/1333 , G02F1/1335
摘要： A display panel module including a display panel is provided, which defines a camera region. A backlight assembly disposed under the display panel, and a camera disposed under the backlight assembly; the backlight assembly includes a circuit board and light source units disposed on the circuit board at intervals; the circuit board in the backlight assembly is inclined downward and recessed at a position corresponding to the camera region to form a hollow funnel shape with a larger top opening and a smaller bottom opening; the top opening of the hollow funnel adjacent to the display panel is defined as a first opening, and the bottom opening adjacent to the camera is defined as a second opening; and light incident from outside can enter the camera through the first and second openings. The invention provides a display panel module, which provides a novel under-screen camera solution.
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公开(公告)号：US11187940B2
公开(公告)日：2021-11-30
申请号：US16604270
申请日：2019-04-11
发明人： Yong Yang
IPC分类号： G02F1/13357 , H01L33/62
摘要： A backlight module having a surface light source, a liquid crystal display panel, and a welding method of a light-emitting diode chip are provided. The backlight module having a surface light source including: a first pad and a second pad disposed on a substrate; a plurality of pad holes disposed in the first pad and the second pad; a magnetic film layer disposed in the plurality of pad holes; a solder paste disposed both on the first pad and the second pad; a light-emitting diode chip, wherein a plurality of pins disposed on two sides of the light-emitting diode chip are absorbed on the magnetic film layer and are connected to both the first pad and the second pad respectively by the solder paste.
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公开(公告)号：US20210333635A1
公开(公告)日：2021-10-28
申请号：US16604270
申请日：2019-04-11
发明人： Yong Yang
IPC分类号： G02F1/13357 , H01L33/62
摘要： A backlight module having a surface light source, a liquid crystal display panel, and a welding method of a light-emitting diode chip are provided. The backlight module having a surface light source including: a first pad and a second pad disposed on a substrate; a plurality of pad holes disposed in the first pad and the second pad; a magnetic film layer disposed in the plurality of pad holes; a solder paste disposed both on the first pad and the second pad; a light-emitting diode chip, wherein a plurality of pins disposed on two sides of the light-emitting diode chip are absorbed on the magnetic film layer and are connected to both the first pad and the second pad respectively by the solder paste.
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公开(公告)号：US11018118B2
公开(公告)日：2021-05-25
申请号：US16476568
申请日：2018-11-23
发明人： Yong Yang
IPC分类号： H01L25/075 , H01L33/58 , H01L33/62 , G02F1/13357
摘要： A backlight device and a manufacturing method thereof are provided. The backlight device includes a substrate, a Light-Emitting Diode (LED) layer and a band-pass filter. The LED layer is disposed on the substrate and includes a plurality of LED chips arranged at intervals. The band-pass filter is disposed on the LED layer and is provided with openings formed at positions corresponding to the LED chips.
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公开(公告)号：US10969534B2
公开(公告)日：2021-04-06
申请号：US16612781
申请日：2019-10-17
发明人： Yong Yang
IPC分类号： G02F1/1334 , F21V8/00 , G02F1/1343
摘要： A backlight assembly is provided, which includes a side-lit backlight module having a plurality of light-emitting units disposed along a first direction, wherein a state of each of the light-emitting units can be individually controlled. A liquid crystal cell is disposed on the side-lit backlight module, wherein the liquid crystal cell has a plurality of pixel units disposed along a second direction, each pixel unit has two states of a transparent state and a cloudy state, and the state of each pixel unit can be individually controlled. The plurality of light-emitting units intersect with the plurality of pixel units.
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公开(公告)号：US10773993B2
公开(公告)日：2020-09-15
申请号：US15578985
申请日：2017-11-14
发明人： Yong Yang , Yingbao Yang
摘要： A cover glass and a manufacturing method thereof are provided, the method includes: coating a first organic layer on a transparent substrate; forming first via holes on the first organic layer at intervals, heating and melting the first organic layer to flow; wet-etching the transparent substrate having the first organic layer to form a first microstructure on a region of the transparent substrate not shielded by the first organic layer; and removing the first organic layer form the transparent substrate. The present disclosure breaks the limitation for preparing microstructures with size below 5 μm in the existing photolithography process, the organic material in wet-etching process can be controlled by heating to make the organic material melted to flow. The size of the microstructure can be reduced and flexibly adjusted according to the pixel size of display panel, the speckle effect of the display device caused by anti-glare treatment can be reduced.
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公开(公告)号：US20210222867A1
公开(公告)日：2021-07-22
申请号：US16308350
申请日：2018-10-09
发明人： Yong Yang
摘要： A backlight module and a method of manufacturing same are provided. The backlight module includes a flexible circuit substrate. The flexible circuit substrate includes a flexible substrate, a first pad, a second pad, a mineral oil layer, and a light emitting diode (LED) chip. The first pad and the second pad are disposed on the flexible substrate. The mineral oil layer is disposed on the flexible substrate and is patterned to form a window opening region. Two ends of the LED chip are electrically connected to a positive electrode of the first pad and a negative electrode of the second pad respectively through the window opening region. The window opening region exposes at least the positive electrode and the negative electrode.
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公开(公告)号：US11054698B2
公开(公告)日：2021-07-06
申请号：US16215630
申请日：2018-12-10
发明人： Guiyang Zhang , Guowei Zha , Hongqing Cui , Yong Yang
IPC分类号： G02F1/13357 , G02F1/1335
摘要： The present disclosure discloses a backlight module and a display device. The light emission direction of at least one of the lamp source and the fluorescent film is provided with a diffusely reflecting layer. The diffusely reflecting layer arranged above the lamp source diffusely reflects pump light emitted from the lamp source, which may enhance uniformity of the pump light. The diffusely reflecting layer arranged above the fluorescent film scatters light emitted from the fluorescent film, scatters the light and distributes the light to a larger range, which may improve light mixing uniformity and improve the uniformity of light emission brightness.
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