Invention Grant
- Patent Title: Backlight module having a surface light source, liquid crystal display panel and welding method of light-emitting diode chip
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Application No.: US16604270Application Date: 2019-04-11
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Publication No.: US11187940B2Publication Date: 2021-11-30
- Inventor: Yong Yang
- Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Hubei
- Assignee: Wuhan China Star Optoelectronics Technology Co., Ltd.
- Current Assignee: Wuhan China Star Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Hubei
- Agency: Taft Stettinius & Hollister LLP
- Priority: CN201811436592.6 20181128
- International Application: PCT/CN2019/082172 WO 20190411
- International Announcement: WO2020/107770 WO 20200604
- Main IPC: G02F1/13357
- IPC: G02F1/13357 ; H01L33/62

Abstract:
A backlight module having a surface light source, a liquid crystal display panel, and a welding method of a light-emitting diode chip are provided. The backlight module having a surface light source including: a first pad and a second pad disposed on a substrate; a plurality of pad holes disposed in the first pad and the second pad; a magnetic film layer disposed in the plurality of pad holes; a solder paste disposed both on the first pad and the second pad; a light-emitting diode chip, wherein a plurality of pins disposed on two sides of the light-emitting diode chip are absorbed on the magnetic film layer and are connected to both the first pad and the second pad respectively by the solder paste.
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