- 专利标题： Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit
-
申请号： US13425589申请日： 2012-03-21
-
公开(公告)号： US11189537B2公开(公告)日： 2021-11-30
- 发明人: Khalil Hosseini , Joachim Mahler , Edward Fuergut
- 申请人： Khalil Hosseini , Joachim Mahler , Edward Fuergut
- 申请人地址： DE Weihmichl; DE Regensburg; DE Dasing
- 专利权人： Khalil Hosseini,Joachim Mahler,Edward Fuergut
- 当前专利权人： Khalil Hosseini,Joachim Mahler,Edward Fuergut
- 当前专利权人地址： DE Weihmichl; DE Regensburg; DE Dasing
- 代理机构： Viering, Jentschura & Partner mbB
- 主分类号： H01L23/051
- IPC分类号： H01L23/051 ; H01L21/56 ; H01L23/495 ; H01L23/00 ; H01L23/31
摘要：
A circuit package is provided, the circuit package including: an electronic circuit; a metal block next to the electronic circuit; encapsulation material between the electronic circuit and the metal block; a first metal layer structure electrically contacted to at least one first contact on a first side of the electronic circuit; a second metal layer structure electrically contacted to at least one second contact on a second side of the electronic circuit, wherein the second side is opposite to the first side; wherein the metal block is electrically contacted to the first metal layer structure and to the second metal layer structure by means of an electrically conductive medium; and wherein the electrically conductive medium includes a material different from the material of the first and second metal layer structures or has a material structure different from the material of the first and second metal layer structures.
公开/授权文献
信息查询
IPC分类:
