Invention Grant
- Patent Title: Method to create multilayer microfluidic chips using spin-on carbon as gap filling materials
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Application No.: US16419684Application Date: 2019-05-22
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Publication No.: US11192101B2Publication Date: 2021-12-07
- Inventor: Chi-Chun Liu , Yann Mignot , Joshua T. Smith , Bassem M. Hamieh , Nelson Felix , Robert L. Bruce
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel P. Morris, Esq.
- Main IPC: B01L3/00
- IPC: B01L3/00 ; B81C1/00 ; B81B7/00

Abstract:
A microfluidic chip with high volumetric flow rate is provided that includes at least two vertically stacked microfluidic channel layers, each microfluidic channel layer including an array of spaced apart pillars. Each microfluidic channel layer is interconnected by an inlet/outlet opening that extends through the microfluidic chip. The microfluidic chip is created without wafer to wafer bonding thus circumventing the cost and yield issues associated with microfluidic chips that are created by wafer bonding.
Public/Granted literature
- US20200070150A1 METHOD TO CREATE MULTILAYER MICROFLUIDIC CHIPS USING SPIN-ON CARBON AS GAP FILLING MATERIALS Public/Granted day:2020-03-05
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