- 专利标题： Methods and systems to detect sub-surface defects in electronics modules using shear force microscopy
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申请号： US16778791申请日： 2020-01-31
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公开(公告)号： US11193913B2公开(公告)日： 2021-12-07
- 发明人: Shailesh N. Joshi , Vishnu Baba Sundaresan , Vijay Venkatesh
- 申请人： Toyota Motor Engineering & Manufacturing North America, Inc. , The Ohio State University
- 申请人地址： US TX Plano; US OH Columbus
- 专利权人： Toyota Motor Engineering & Manufacturing North America, Inc.,The Ohio State University
- 当前专利权人： Toyota Motor Engineering & Manufacturing North America, Inc.,The Ohio State University
- 当前专利权人地址： US TX Plano; US OH Columbus
- 代理机构： Dinsmore & Shohl LLP
- 主分类号： G01N29/34
- IPC分类号： G01N29/34 ; G01N29/04 ; G01N29/06
摘要：
A method of detecting sub-surface voids in a sample comprises positioning a probe adjacent to a first point on the sample, emitting an ultrasonic wave from the probe towards the sample, moving the probe towards the sample, measuring a shear force amplitude of a reflection of the ultrasonic wave at the probe as the probe moves towards the sample, creating an approach curve by plotting the measured shear force amplitude of the reflection of the ultrasonic wave as a function of a distance between the probe and the sample, and determining whether a sub-surface void exists at the first point on the sample based on a slope of the approach curve.
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