Invention Grant
- Patent Title: Stacked silicon package assembly having thermal management using phase change material
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Application No.: US16828822Application Date: 2020-03-24
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Publication No.: US11195780B1Publication Date: 2021-12-07
- Inventor: Jaspreet Singh Gandhi , Gamal Refai-Ahmed , Suresh Ramalingam
- Applicant: XILINX, INC.
- Applicant Address: US CA San Jose
- Assignee: XILINX, INC.
- Current Assignee: XILINX, INC.
- Current Assignee Address: US CA San Jose
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L31/12
- IPC: H01L31/12 ; H01L23/427 ; H01L23/373 ; H01L25/00 ; H01L21/56 ; H01L25/065 ; H01L23/10
Abstract:
A chip package assembly and method for fabricating the same are provided which incorporate phase change materials within the chip package assembly for improved thermal management. In one example, a chip package assembly is provided that includes a substrate, a first integrated circuit (IC) die stacked on the substrate, a dielectric filler layer, a cover and a phase change material. The phase change material is sealed within a recess formed between the first IC dies and the cover.
Information query
IPC分类:
