Invention Grant
- Patent Title: High-frequency front-end module and communication device
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Application No.: US16950985Application Date: 2020-11-18
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Publication No.: US11201632B2Publication Date: 2021-12-14
- Inventor: Motoji Tsuda
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JPJP2018-106933 20180604
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H04B1/16 ; H04B1/7093

Abstract:
A high-frequency front-end module includes transmission amplifier circuits, a transmission filter that is connected between a common terminal and the transmission amplifier circuit and has a transmission band of a band A as a pass band, a reception filter that is connected to the common terminal and has a reception band of a predetermined communication band as a pass band, in which a frequency of an intermodulation distortion generated by a transmission signal from the transmission amplifier circuit and a transmission signal from the transmission amplifier circuit overlaps the pass band, and a band elimination filter that is disposed in a signal path connecting an output terminal of the transmission amplifier circuit and the transmission filter, and has a transmission band of the band A as a pass band and a transmission band of a band B as an attenuation band.
Public/Granted literature
- US20210075450A1 HIGH-FREQUENCY FRONT-END MODULE AND COMMUNICATION DEVICE Public/Granted day:2021-03-11
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