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公开(公告)号：US11942973B2
公开(公告)日：2024-03-26
申请号：US17671591
申请日：2022-02-15
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motoji Tsuda
CPC classification number: H04B1/0067 , H04B1/006 , H04B1/04 , H04B2001/0408
Abstract: A radio frequency module includes a substrate, a power amplifier that amplifies a transmission signal in a first communication band, a power amplifier that amplifies a transmission signal in a second communication band, and a power amplifier that amplifies a transmission signal in a third communication band. Simultaneous transmission can be performed in a combination of the first communication band and the third communication band. Simultaneous transmission cannot be performed in a combination of the first communication band and the second communication band and a combination of the second communication band and the third communication band. In plan view of the substrate, a distance between the output terminals of the power amplifier and the power amplifier is longer than a distance between the output terminals of the power amplifier and the power amplifier and a distance between the output terminals of the power amplifier and the power amplifier.
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公开(公告)号：US09166556B2
公开(公告)日：2015-10-20
申请号：US14339578
申请日：2014-07-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motoji Tsuda
CPC classification number: H03H9/542 , H03H9/0557 , H03H9/08 , H03H9/25 , H03H9/64 , H03H9/6483 , H03H9/706 , H03H9/725
Abstract: An elastic wave device includes a resonator and an inductor. One end of the inductor is connected to the resonator, and the other end of the inductor is connected to a ground electrode or a signal electrode. The elastic wave device includes a chip and a mounting substrate. The chip includes a piezoelectric substrate and an interdigital transducer electrode provided on the piezoelectric substrate so define the resonator. The chip is mounted on the mounting substrate. The inductor is provided to the mounting substrate. A dummy electrode to which the one end side of the inductor is connected and the ground electrode or the signal electrode are provided on a surface of the mounting substrate that is opposite to the chip.
Abstract translation: 弹性波装置包括谐振器和电感器。 电感器的一端连接到谐振器，电感器的另一端连接到接地电极或信号电极。 弹性波装置包括芯片和安装基板。 芯片包括压电基片和设置在压电基片上的叉指式换能器电极，从而限定了谐振器。 芯片安装在安装基板上。 电感器被提供到安装基板。 连接电感器的一端侧的虚拟电极和接地电极或信号电极设置在与芯片相对的安装基板的表面上。
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公开(公告)号：US11381261B2
公开(公告)日：2022-07-05
申请号：US17368958
申请日：2021-07-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motoji Tsuda , Yusuke Naniwa , Morio Takeuchi , Atsushi Horita , Jin Yokoyama , Sho Matsumoto , Syunsuke Kido , Yukiya Yamaguchi , Hiroyuki Kani
Abstract: A radio-frequency module includes a transmission path which has one end connected to a transmission terminal and on which a transmission signal in Band A is transmitted; a reception path (62) which has one end connected to a reception terminal (120B) and on which a reception signal in Band B is transmitted; a reception path (63) which has one end connected to a reception terminal (120C) and on which a reception signal in Band C is transmitted; a switch (11) having a common terminal (11a) and selection terminals (11b and 11c); and a switch (12) having a common terminal (12a) and selection terminals (12b and 12c).
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公开(公告)号：US09978929B2
公开(公告)日：2018-05-22
申请号：US14619367
申请日：2015-02-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Mitsuyoshi Hira , Motoji Tsuda
IPC: H01L41/04 , H01L41/053 , H03H9/10
CPC classification number: H01L41/0533 , H01L2224/11 , H01L2224/16225 , H01L2924/181 , H03H9/1085 , Y10T156/1092 , H01L2924/00012
Abstract: An electronic component includes a package substrate, an electronic component element mounted on the package substrate and includes an element substrate, a support layer, and a cover member, and a mold resin layer provided on the package substrate so as to seal the electronic component element. The cover member includes a first cover member provided on the package substrate and a second cover member provided on the first cover member. The glass transition temperature of a resin material of the first cover member is higher than that of a resin material of the second cover member.
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公开(公告)号：US09748919B2
公开(公告)日：2017-08-29
申请号：US14699007
申请日：2015-04-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Mitsuyoshi Hira , Motoji Tsuda
IPC: H03H9/10 , H03H9/05 , H01L41/053 , H03H9/02
CPC classification number: H03H9/1085 , H01L41/0533 , H03H9/02992 , H03H9/059 , H03H9/1071 , H03H9/1092
Abstract: An elastic wave device includes a piezoelectric substrate, an IDT electrode, and a cover member. The IDT electrode is provided on the piezoelectric substrate. The cover member is provided above the piezoelectric substrate and separate from the IDT electrode. The cover member includes a first cover member and a second cover member. The second cover member is laminated on a side of the first cover member opposite to the piezoelectric substrate. The glass transition point of the first cover member is higher than that of the second cover member.
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Patent Agency Ranking
公开(公告)号：US09692390B2
公开(公告)日：2017-06-27
申请号：US14444039
申请日：2014-07-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motoji Tsuda
CPC classification number: H03H9/6489 , H03H9/02992 , H03H9/25 , H03H9/725
Abstract: A filter device includes a piezoelectric substrate, an IDT arranged on a major surface of the piezoelectric substrate to define a surface acoustic wave resonator, a wiring electrode that is electrically connected to the IDT, and an acoustic member located on a major surface of the piezoelectric substrate near or adjacent to the IDT and that has an acoustic impedance different from that of the piezoelectric substrate. The wiring electrode that is to be disposed in the vicinity of the IDT is located on the acoustic member.
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公开(公告)号：US12101110B2
公开(公告)日：2024-09-24
申请号：US18187994
申请日：2023-03-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motoji Tsuda , Hayato Nakamura
CPC classification number: H04B1/04 , H03F3/245 , H03F2200/451 , H04B2001/0408
Abstract: A radio frequency module includes a module substrate; a power amplifier disposed on or over the module substrate, amplifies a radio frequency signal, and outputs the amplified radio frequency signal as the first transmission signal; a power amplifier disposed on or over the module substrate, amplifies a radio frequency signal, and outputs the amplified radio frequency signal as the second transmission signal; a temperature sensor disposed on or over the module substrate; and a PA control circuit disposed on or over the module substrate and controls amplification operations of the power amplifiers according to a measurement value of the temperature sensor. The maximum output power of the power amplifier is greater than the maximum output power of the power amplifier, and the distance between the temperature sensor and the power amplifier is less than or equal to the distance between the temperature sensor and the power amplifier.
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公开(公告)号：US11290135B2
公开(公告)日：2022-03-29
申请号：US17222231
申请日：2021-04-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motoji Tsuda , Takayuki Nakamura , Daerok Oh
IPC: H04B7/0413 , H04B1/00 , H04B1/12 , H04B1/18
Abstract: A high-frequency front end module includes a primary antenna terminal and a secondary antenna terminal, a first multiplexer and a second multiplexer, a switch circuit, and a first amplifier and a second amplifier. The first multiplexer has a first transmission filter and a first reception filter. The second multiplexer has a second transmission filter and a second reception filter. The switch circuit exclusively switches connection between the primary antenna terminal and the first multiplexer and connection between the primary antenna terminal and the second multiplexer, and exclusively switches connection between the secondary antenna terminal and the first multiplexer and connection between the secondary antenna terminal and the second multiplexer.
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公开(公告)号：US11201632B2
公开(公告)日：2021-12-14
申请号：US16950985
申请日：2020-11-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motoji Tsuda
IPC: H04B1/04 , H04B1/16 , H04B1/7093
Abstract: A high-frequency front-end module includes transmission amplifier circuits, a transmission filter that is connected between a common terminal and the transmission amplifier circuit and has a transmission band of a band A as a pass band, a reception filter that is connected to the common terminal and has a reception band of a predetermined communication band as a pass band, in which a frequency of an intermodulation distortion generated by a transmission signal from the transmission amplifier circuit and a transmission signal from the transmission amplifier circuit overlaps the pass band, and a band elimination filter that is disposed in a signal path connecting an output terminal of the transmission amplifier circuit and the transmission filter, and has a transmission band of the band A as a pass band and a transmission band of a band B as an attenuation band.
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公开(公告)号：US10971466B2
公开(公告)日：2021-04-06
申请号：US16533982
申请日：2019-08-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Katsunari Nakazawa , Takanori Uejima , Motoji Tsuda , Yuji Takematsu , Dai Nakagawa , Tetsuro Harada , Masahide Takebe , Naoya Matsumoto , Yoshiaki Sukemori , Mitsunori Samata , Yutaka Sasaki , Yuuki Fukuda
IPC: H03F3/21 , H03F1/30 , H01L23/00 , H01L25/16 , H01L23/66 , H01L23/367 , H01L23/538 , H04B1/40
Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.
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