Invention Grant
- Patent Title: Microelectromechanical system cavity packaging
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Application No.: US16798775Application Date: 2020-02-24
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Publication No.: US11203524B2Publication Date: 2021-12-21
- Inventor: Jose Antonio Martinez
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Michelle F. Murray; Charles A. Brill; Frank D. Cimino
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81B7/00 ; H01L23/552 ; H01L23/00

Abstract:
In described examples, a cavity is formed between a substrate and a cap. One or more access holes are formed through the cap for removing portions of a sacrificial layer from within the cavity. A cover is supported by the cap, where the cover is for occulting the one or more access holes along a perspective. An encapsulant seals the cavity, where the encapsulant encapsulates the cover and the one or more access holes.
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