Invention Grant
- Patent Title: Low resistance fingerprint sensor and method of manufacturing the same
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Application No.: US16370119Application Date: 2019-03-29
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Publication No.: US11205061B2Publication Date: 2021-12-21
- Inventor: Seokwhan Chung
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2018-0095732 20180816
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06F3/044

Abstract:
A fingerprint sensor includes a substrate, and a plurality of first electrodes disposed on the substrate, and including a plurality of first pattern parts and a plurality of first connectors. The plurality of first electrodes is repeatedly arranged in a second direction intersecting a first direction, and the plurality of first connectors connects the plurality of first pattern parts in the first direction. The fingerprint sensor further includes an insulating layer disposed on the plurality of first electrodes, and a plurality of second electrodes disposed on the insulating layer, and including a plurality of second pattern parts and a plurality of second connectors. The plurality of second electrodes is repeatedly arranged in the first direction, and the plurality of second connectors connects the plurality of second pattern parts in the second direction. The plurality of first connectors and/or the plurality of second connectors include a metal material.
Public/Granted literature
- US20200057878A1 LOW RESISTANCE FINGERPRINT SENSOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2020-02-20
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