Invention Grant
- Patent Title: Device and method for alignment of vertically stacked wafers and die
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Application No.: US16808090Application Date: 2020-03-03
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Publication No.: US11205621B2Publication Date: 2021-12-21
- Inventor: John H. Zhang , Walter Kleemeier , Paul Ferreira , Ronald K. Sampson
- Applicant: STMICROELECTRONICS, INC.
- Applicant Address: US TX Coppell
- Assignee: STMICROELECTRONICS, INC.
- Current Assignee: STMICROELECTRONICS, INC.
- Current Assignee Address: US TX Coppell
- Agency: Seed IP Law Group LLP
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L21/66 ; H01L25/065 ; H01L25/00
Abstract:
A device is provided that includes a first die having a first alignment structure that includes a plurality of first transmission columns arranged in a pattern and a second die positioned on the first die, the second die having a second alignment structure that includes a plurality of second transmission columns arranged in the same pattern as the first transmission columns. The first and second transmission columns are each coplanar with a first surface and a second surface of the first and second die, respectively.
Information query
IPC分类:
