Invention Grant
- Patent Title: Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies
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Application No.: US16648115Application Date: 2017-12-28
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Publication No.: US11206008B2Publication Date: 2021-12-21
- Inventor: Georgios C. Dogiamis , Telesphor Kamgaing , Feras Eid , Vijay K. Nair , Johanna M. Swan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2017/068725 WO 20171228
- International Announcement: WO2019/132921 WO 20190704
- Main IPC: H03H9/05
- IPC: H03H9/05 ; H03H9/10 ; H03H9/13 ; H03H9/52 ; H03H9/54

Abstract:
Embodiments of the invention include an acoustic wave resonator (AWR) module. In an embodiment, the AWR module may include a first AWR substrate and a second AWR substrate affixed to the first AWR substrate. In an embodiment, the first AWR substrate and the second AWR substrate define a hermetically sealed cavity. A first AWR device may be positioned in the cavity and formed on the first AWR substrate, and a second AWR device may be positioned in the cavity and formed on the second AWR substrate. In an embodiment, a center frequency of the first AWR device is different than a center frequency of the second AWR device. In additional embodiment of the invention, the AWR module may be integrated into a hybrid filter. The hybrid filter may include an AWR module and other RF passive devices embedded in a packaging substrate.
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