- 专利标题: Sound transducer structure of electronic device
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申请号: US16989912申请日: 2020-08-11
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公开(公告)号: US11206477B2公开(公告)日: 2021-12-21
- 发明人: Bo Xiao , Ronglin Linghu , Xiaodong Liu
- 申请人: AAC Technologies Pte. Ltd.
- 申请人地址: SG Singapore
- 专利权人: AAC Technologies Pte. Ltd.
- 当前专利权人: AAC Technologies Pte. Ltd.
- 当前专利权人地址: SG Singapore
- 代理机构: W&G Law Group
- 主分类号: H04R1/02
- IPC分类号: H04R1/02 ; H04R1/28
摘要:
The present invention provides a sound transducer structure of electronic device relating to the technical field of acoustics. The sound transducer structure includes a housing having an accommodating cavity, a sound generator received in the accommodating cavity, and a sound outlet disposed in the housing. A sound guiding groove communicates between the sound generator and the sound outlet, so that a sound generated at the sound generator is conducted along the sound guiding groove and is transmitted out of the housing from the sound outlet. The sound outlet includes a first sound outlet for transmitting sound in a receiver mode and a second sound outlet for transmitting sound in a loudspeaker mode. The second sound outlet is covered with a sound pressure sensitive member.
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