Invention Grant
- Patent Title: Reliable interconnect for camera image sensors
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Application No.: US16460963Application Date: 2019-07-02
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Publication No.: US11206732B2Publication Date: 2021-12-21
- Inventor: Matthew Last , Unique Rahangdale , Giulia Guidi , Roya Mirhosseini-Schubert
- Applicant: Waymo LLC
- Applicant Address: US CA Mountain View
- Assignee: Waymo LLC
- Current Assignee: Waymo LLC
- Current Assignee Address: US CA Mountain View
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12 ; H05K1/02 ; H05K1/11 ; H05K3/46 ; H05K3/10 ; H05K1/18

Abstract:
The present disclosure relates to optical systems and methods of their manufacture. An example system includes a printed circuit board assembly (PCBA) and an image sensor package coupled to the PCBA by way of a plurality of bond members. The system additionally includes a sensor holder coupled to the PCBA. The image sensor package and the sensor holder are coupled to the PCBA so as to minimize thermally-induced stresses in at least one of: the plurality of bond members, the PCBA, the sensor holder, or the image sensor package.
Public/Granted literature
- US20210007216A1 Reliable Interconnect for Camera Image Sensors Public/Granted day:2021-01-07
Information query