A fluid heat dissipation device is provided. The fluid heat dissipation device includes a heat sink body and a plurality of pasting elements. The heat sink body is a porous structure, and pores of the heat sink body are configured to enable the heat sink body to absorb a working fluid that can be liquid or gas. The pasting elements are fixed on a first surface of the heat sink body. The pasting elements include polymer materials and are sheet-like colloids. The heat sink body is fixedly attached onto an outer surface of an electronic device through the pasting elements. A thickness gap of the pasting element is a vaporization chamber, and the working fluid in the pores can absorb heat from the electronic device and then be vaporized to remove heat through the heat sink body.