Invention Grant
- Patent Title: Ethylene-based resins for closure applications
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Application No.: US15328312Application Date: 2015-08-25
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Publication No.: US11208546B2Publication Date: 2021-12-28
- Inventor: Mridula Kapur , Stephanie M. Whited , Mark T. Jablonka
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- International Application: PCT/US2015/046658 WO 20150825
- International Announcement: WO2016/033018 WO 20160303
- Main IPC: C08L23/08
- IPC: C08L23/08 ; C08L23/04 ; B65D53/00 ; C08L23/06

Abstract:
An ethylene-based resin comprising a high molecular weight component and a low molecular weight component, wherein the high molecular weight component comprises an ethylene/alpha-olefin copolymer or ethylene homopolymer, and has a density ranging from 0.940 g/cc to 0.960 g/cc, and a high load melt index (I21.6) ranging from 4 g/10 min to 15 g/10 min, and wherein the ethylene-based resin has: an overall density ranging from greater than 0.955 to less than or equal to 0.970 g/cc, an overall melt index (I2.16) ranging from 0.5 g/10 min to 7 g/10 min, and less than 0.2 vinyls per 1000 carbon atoms.
Public/Granted literature
- US20170210891A1 ETHYLENE-BASED RESINS FOR CLOSURE APPLICATIONS Public/Granted day:2017-07-27
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