Process to form a tile using low temperature heat lamination

    公开(公告)号:US11376833B2

    公开(公告)日:2022-07-05

    申请号:US16639465

    申请日:2018-08-16

    摘要: A method to produce a tile comprising at least the following layered sections: a wear layered section, a decor layered section and a base layered section; and wherein the wear layered section comprises the following: A) a compositional layer A formed from a composition A comprising at least one olefin-based polymer; wherein the decor layered section comprises the following: B1) a compositional layer B1 formed from a composition B1 comprising a propylene-based polymer; B2) a compositional layer B2 formed from a composition B2 comprising an olefin-based polymer; wherein the base layered section comprises the following: C) a compositional layer C formed from a composition C comprising an olefin-based polymer; wherein the method comprises the following step(s): i) heat laminating compositional layer A to compositional layer B1, at a temperature T1≤140° C.; and wherein, for a continuous production of the tile, T1 is the temperature at the surface of the compositional layer with the highest, or equivalent, surface temperature; and for a batch production of the tile, T1 is the interfacial temperature between the two compositional layers; ii) heat laminating compositional layer B2 to compositional layer C, at a interfacial temperature T2≤140° C.; and wherein, for a continuous production of the tile, T2 is the temperature at the surface of the compositional layer with the highest, or equivalent, surface temperature; and for a batch production of the tile, T2 is the interfacial temperature between the two compositional layers.

    Ethylene-based resins for closure applications

    公开(公告)号:US11208546B2

    公开(公告)日:2021-12-28

    申请号:US15328312

    申请日:2015-08-25

    摘要: An ethylene-based resin comprising a high molecular weight component and a low molecular weight component, wherein the high molecular weight component comprises an ethylene/alpha-olefin copolymer or ethylene homopolymer, and has a density ranging from 0.940 g/cc to 0.960 g/cc, and a high load melt index (I21.6) ranging from 4 g/10 min to 15 g/10 min, and wherein the ethylene-based resin has: an overall density ranging from greater than 0.955 to less than or equal to 0.970 g/cc, an overall melt index (I2.16) ranging from 0.5 g/10 min to 7 g/10 min, and less than 0.2 vinyls per 1000 carbon atoms.

    PROCESS TO FORM A TILE USING LOW TEMPERATURE HEAT LAMINATION

    公开(公告)号:US20210129513A1

    公开(公告)日:2021-05-06

    申请号:US16639465

    申请日:2018-08-16

    摘要: A method to produce a tile comprising at least the following layered sections: a wear layered section, a décor layered section and a base layered section; and wherein the wear layered section comprises the following: A) a compositional layer A formed from a composition A comprising at least one olefm-based polymer; wherein the décor layered section comprises the following: B1) a compositional layer B1 formed from a composition B1 comprising a propylene-based polymer; B2) a compositional layer B2 formed rl from a composition B2 comprising an olefm-based polymer; wherein the base layered section comprises the following: C) a compositional layer C formed from a composition C comprising an olefin-based polymer; wherein the method comprises the following step(s): i) heat laminating compositional layer A to compositional layer B1, at a temperature T1≤140° C.; and wherein, for a continuous production of the tile, T1 is the temperature at the surface of the compositional layer with the highest, or equivalent, surface temperature; and for a batch production of the tile, T1 is the interfacial temperature between the two compositional layers; ii) heat laminating compositional layer B2 to compositional layer C, at a interfacial temperature T2≤140° C.; and wherein, for a continuous production of the tile, T2 is the temperature at the surface of the compositional layer with the highest, or equivalent, surface temperature; and for a batch production of the tile, T2 is the interfacial temperature between the two compositional layers.