Invention Grant
- Patent Title: Pressure sensor device formed in board and electronic device including the same
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Application No.: US16506251Application Date: 2019-07-09
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Publication No.: US11209326B2Publication Date: 2021-12-28
- Inventor: Hyunwoo Sim , Seongjun Kim , Yonghwa Kim , Dongil Son , Jaedeok Lim , Seungbum Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2018-0079942 20180710
- Main IPC: G01L1/22
- IPC: G01L1/22 ; H05K1/02 ; G06F3/045

Abstract:
An electronic device for detecting pressure is provided. The electronic device includes a printed circuit board (PCB) including at least one element or circuit pattern for driving the electronic device, at least one electrode pattern formed to detect a pressure in the wiring layer included in the PCB, an elastic member arranged to be at least partially overlapped with the electrode pattern, and a pressure sensor circuit electrically connected to the electrode pattern included in the PCB. The pressure sensor circuit is configured to apply a voltage to the electrode pattern and measure intensity of the pressure based on a change in the voltage applied to the electrode pattern.
Public/Granted literature
- US20200018657A1 PRESSURE SENSOR DEVICE FORMED IN BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2020-01-16
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