Invention Grant
- Patent Title: Carrier substrate and packaging method using the same
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Application No.: US16424834Application Date: 2019-05-29
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Publication No.: US11211273B2Publication Date: 2021-12-28
- Inventor: Ji-Han Ko , Wonkeun Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2018-0127159 20181024
- Main IPC: H01L21/673
- IPC: H01L21/673 ; H01L21/50 ; C03C27/06 ; B32B17/06 ; H01L23/00
Abstract:
A carrier substrate and a packaging method, the carrier substrate including a first layer; a second layer; and a first glue layer between the first layer and the second layer, wherein the first glue layer is removably attached to the first layer.
Information query
IPC分类:
