Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16848145Application Date: 2020-04-14
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Publication No.: US11211497B2Publication Date: 2021-12-28
- Inventor: Jung Gun You , Dong Hyun Kim , Byoung-Gi Kim , Yun Suk Nam , Yeong Min Jeon , Sung Chui Park , Dae Won Ha
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, PC
- Priority: KR10-2017-0174149 20171218
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/66 ; H01L21/8238 ; H01L21/762 ; H01L23/532 ; H01L21/8234 ; H01L27/088 ; H01L29/165

Abstract:
A semiconductor device includes first and second fin patterns on a substrate and extending apart from each other, a field insulating film on the substrate and surrounding parts of the first and second fin patterns, a first gate structure on the first fin pattern and intersecting the first fin pattern, a second gate structure on the second fin pattern and intersecting the second fin pattern, and a separating structure protruding from a top surface of the field insulating film and separating the first and second gate structures, the field insulating film and the separating structure including a same insulating material.
Public/Granted literature
- US20200243684A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-07-30
Information query
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