Invention Grant
- Patent Title: Optical device package and method for manufacturing the same
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Application No.: US15998408Application Date: 2018-08-15
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Publication No.: US11215762B2Publication Date: 2022-01-04
- Inventor: Huang-Hsien Chang , Po Ju Wu , Yu Cheng Chen , Wen-Long Lu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: G02B6/44
- IPC: G02B6/44 ; G02B6/36 ; G02B6/42

Abstract:
An optical device package includes a semiconductor substrate, and an optical device. The semiconductor substrate has a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface. A surface roughness of the profile is greater than a surface roughness of the second surface. The optical device is disposed on the second surface and surrounded by the profile.
Public/Granted literature
- US20200057201A1 Optica device package and method for manufacturing the same Public/Granted day:2020-02-20
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