Invention Grant
- Patent Title: Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
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Application No.: US16231238Application Date: 2018-12-21
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Publication No.: US11217516B2Publication Date: 2022-01-04
- Inventor: Sriram Muthukumar , Charles A. Gealer
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP.
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31 ; H01L23/00 ; H01L25/065 ; H01L25/10 ; H01L25/18 ; H01L25/00 ; H01L25/16
Abstract:
A stacked-chip apparatus includes a package substrate and an interposer with a chip stack disposed with a standoff that matches the interposer. A package-on-package stacked-chip apparatus includes a top package disposed on the interposer.
Public/Granted literature
Information query
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