Invention Grant
- Patent Title: Image sensor with split pixel structure and method of manufacturing thereof
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Application No.: US16687660Application Date: 2019-11-18
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Publication No.: US11217613B2Publication Date: 2022-01-04
- Inventor: Bill Phan , Yuanliang Liu , Duli Mao , Seong Yeol Mun , Alireza Bonakdar
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Christensen O'Connor Johnson Kindness PLLC
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/378

Abstract:
An image sensor includes a substrate material. The substrate material includes a plurality of photodiodes disposed therein. The plurality of photodiodes includes a plurality of small photodiodes (SPDs) and a plurality of large photodiodes (LPDs) larger than the SPDs. An array of color filters is disposed over the substrate material. A buffer layer is disposed between the substrate material and the array of color filters. A metal pattern is disposed between the color filters in the array of color filters, and between the array of color filters and the buffer layer. An attenuation layer is disposed between the substrate material and the array of color filters. The attenuation layer is above and aligned with the plurality of SPDs and a portion of each of the plurality of LPDs. An edge of the attenuation layer is over one of the plurality of LPDs.
Public/Granted literature
- US20210151482A1 IMAGE SENSOR WITH SPLIT PIXEL STRUCTURE AND METHOD OF MANUFACTURING THEREOF Public/Granted day:2021-05-20
Information query
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