An assembly comprises a flexible circuit board (FCB) having a substrate with a top side, and a circuit pattern layer on the top side of the substrate. The circuit pattern layer has a connection region for facilitating electrical interconnection to the FCB, and one or more cavities extending through both the substrate and the circuit pattern layer. A first conductive layer for electro-magnetic interference (EMI) shielding is positioned on a top side of the FCB, and a second conductive layer for EMI shielding is positioned on a back side of the FCB. Electrically conductive adhesive extends through the one or more cavities for electrically connecting the first conductive layer and the second conductive layer. The electrically conductive adhesive further extends from the first conductive layer to the connection region for facilitating electrical interconnection of the first conductive layer and the second conductive layer.