公开(公告)号：US11224121B2

公开(公告)日：2022-01-11

申请号：US16971913

申请日：2018-03-16

Applicant: Huawei Technologies Co., Ltd.

Inventor： David Powney ,  Sami Maattanen

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00

Abstract: An assembly comprises a flexible circuit board (FCB) having a substrate with a top side, and a circuit pattern layer on the top side of the substrate. The circuit pattern layer has a connection region for facilitating electrical interconnection to the FCB, and one or more cavities extending through both the substrate and the circuit pattern layer. A first conductive layer for electro-magnetic interference (EMI) shielding is positioned on a top side of the FCB, and a second conductive layer for EMI shielding is positioned on a back side of the FCB. Electrically conductive adhesive extends through the one or more cavities for electrically connecting the first conductive layer and the second conductive layer. The electrically conductive adhesive further extends from the first conductive layer to the connection region for facilitating electrical interconnection of the first conductive layer and the second conductive layer.

公开(公告)号：US20210105890A1

公开(公告)日：2021-04-08

申请号：US16971913

申请日：2018-03-16

Applicant: Huawei Technologies Co., Ltd.

Inventor： David Powney ,  Sami Maattanen

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00

Abstract: An assembly comprises a flexible circuit board (FCB) having a substrate with a top side, and a circuit pattern layer on the top side of the substrate. The circuit pattern layer has a connection region for facilitating electrical interconnection to the FCB, and one or more cavities extending through both the substrate and the circuit pattern layer. A first conductive layer for electro-magnetic interference (EMI) shielding is positioned on a top side of the FCB, and a second conductive layer for EMI shielding is positioned on a back side of the FCB. Electrically conductive adhesive extends through the one or more cavities for electrically connecting the first conductive layer and the second conductive layer. The electrically conductive adhesive further extends from the first conductive layer to the connection region for facilitating electrical interconnection of the first conductive layer and the second conductive layer.

公开(公告)号：US11656397B2

公开(公告)日：2023-05-23

申请号：US17284581

申请日：2018-10-26

Applicant: Huawei Technologies Co., Ltd.

Inventor： Sami Maattanen

IPC: F21V8/00 ,  G02F1/1335 ,  G02B5/04 ,  G02B5/02

CPC classification number: G02B6/0053 ,  G02B5/0242 ,  G02B6/0051 ,  G02F1/133528 ,  G02B5/0268 ,  G02B5/04 ,  G02F2202/28

Abstract: An integral light guide for an electronic display includes a top surface, a bottom surface, and a body extending between the top surface and the bottom surface. The body includes a prism section and a microstructure section, the prism section is arranged adjacent to the top surface, the microstructure section is arranged adjacent to the bottom surface. The prism section includes a prism pattern enclosed within the body.

公开(公告)号：US20210356645A1

公开(公告)日：2021-11-18

申请号：US17284581

申请日：2018-10-26

Applicant: Huawei Technologies Co., Ltd.

Inventor： Sami Maattanen

IPC: F21V8/00 ,  G02F1/1335

Abstract: An integral light guide for an electronic display includes a top surface, a bottom surface, and a body extending between the top surface and the bottom surface. The body includes a prism section and a microstructure section, the prism section is arranged adjacent to the top surface, the microstructure section is arranged adjacent to the bottom surface. The prism section includes a prism pattern enclosed within the body.