Invention Grant
- Patent Title: Air cavity package using high temperature silicone adhesive
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Application No.: US15590144Application Date: 2017-05-09
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Publication No.: US11227806B2Publication Date: 2022-01-18
- Inventor: Richard J. Koba , Chee Kong Lee , Wei Chuan Goh , Sin Yee Chin
- Applicant: Materion Corporation
- Applicant Address: US OH Mayfield Heights
- Assignee: Materion Corporation
- Current Assignee: Materion Corporation
- Current Assignee Address: US OH Mayfield Heights
- Agency: Cozen O'Connor
- Main IPC: H01L23/14
- IPC: H01L23/14 ; H01L23/047 ; H01L23/04 ; H01L23/10 ; H01L23/28 ; H01L23/36 ; H01L23/373
Abstract:
An air cavity package includes a dielectric frame that is formed from an alumina ceramic, a polyimide, or a semi-crystalline thermoplastic. The dielectric frame is joined to a flange using a high temperature silicone adhesive. Leads may be bonded to the dielectric frame using a high temperature organic adhesive, a direct bond, or by brazing.
Public/Granted literature
- US20170323837A1 AIR CAVITY PACKAGE Public/Granted day:2017-11-09
Information query
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