Invention Grant
- Patent Title: Electronic package and substrate structure having chamfers
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Application No.: US16875240Application Date: 2020-05-15
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Publication No.: US11227842B2Publication Date: 2022-01-18
- Inventor: Po-Hao Wang , Chang-Fu Lin , Chun-Tang Lin , Bo-Hao Chang
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498 ; H01L23/31
Abstract:
Provided is a substrate structure, including a substrate having at least one chamfer formed on a surface thereof, and a plurality of conductive bodies formed to the substrate. Therefore, a stress generated during the packaging process is alleviated through the chamfer, and the substrate structure is prevented from being cracked. An electronic package employing the substrate structure is also provided.
Public/Granted literature
- US20200350261A1 ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE HAVING CHAMFERS Public/Granted day:2020-11-05
Information query
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