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公开(公告)号：US20210296261A1
公开(公告)日：2021-09-23
申请号：US17337770
申请日：2021-06-03
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Po-Hao Wang , Chun-Tang Lin , Shou-Qi Chang , Yu-Hsiang Hsieh
IPC: H01L23/00 , H01L23/14 , H01L25/065 , H01L23/498 , H01L23/13
Abstract: A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body. The obtuse portion includes a plurality of turning surfaces to disperse the stress of the substrate body generated in the packaging process. Therefore, the substrate body is prevented from being cracked. A method for fabricating the substrate structure and an electronic package including the substrate structure are also provided.
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2.发明申请公开(公告)号：US20180254250A1
公开(公告)日：2018-09-06
申请号：US15624590
申请日：2017-06-15
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Po-Hao Wang , Chun-Tang Lin , Shou-Qi Chang , Yu-Hsiang Hsieh
CPC classification number: H01L23/562 , H01L23/13 , H01L23/147 , H01L23/3121 , H01L23/49827 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L29/06 , H01L2224/13101 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15159 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/3512 , H01L2924/00012 , H01L2924/014 , H01L2924/00014
Abstract: A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body. The obtuse portion includes a plurality of turning surfaces to disperse the stress of the substrate body generated in the packaging process. Therefore, the substrate body is prevented from being cracked. A method for fabricating the substrate structure and an electronic package including the substrate structure are also provided.
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公开(公告)号：US11527491B2
公开(公告)日：2022-12-13
申请号：US17337770
申请日：2021-06-03
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Po-Hao Wang , Chun-Tang Lin , Shou-Qi Chang , Yu-Hsiang Hsieh
IPC: H01L23/00 , H01L23/14 , H01L25/065 , H01L23/498 , H01L23/13 , H01L23/31
Abstract: A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body. The obtuse portion includes a plurality of turning surfaces to disperse the stress of the substrate body generated in the packaging process. Therefore, the substrate body is prevented from being cracked. A method for fabricating the substrate structure and an electronic package including the substrate structure are also provided.
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公开(公告)号：US10354891B2
公开(公告)日：2019-07-16
申请号：US15945308
申请日：2018-04-04
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Po-Hao Wang , Chih-Jen Yang , Yu-Chih Cheng , Chee-Key Chung , Chang-Fu Lin
IPC: H01L23/52 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/00
Abstract: An electronic package and a method for fabricating the same are provided. The method includes forming a filling material, such as an underfill, between a carrier and a plurality of electronic components and filling the filling material in a space between the electronic components to form a spacing portion. The spacing portion has a first segment and a second segment separated from each other to serve as a stress buffer zone. Therefore, when an encapsulation layer encapsulating the electronic components is subsequently ground, the present disclosure can effectively prevent the electronic components from being cracked due to stresses induced by the external grinding force.
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公开(公告)号：US20190181021A1
公开(公告)日：2019-06-13
申请号：US15945308
申请日：2018-04-04
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Po-Hao Wang , Chih-Jen Yang , Yu-Chih Cheng , Chee-Key Chung , Chang-Fu Lin
IPC: H01L21/56 , H01L23/31 , H01L23/00 , H01L23/498
CPC classification number: H01L21/568 , H01L23/3128 , H01L23/49838 , H01L24/06 , H01L2224/04105 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/3512
Abstract: An electronic package and a method for fabricating the same are provided. The method includes forming a filling material, such as an underfill, between a carrier and a plurality of electronic components and filling the filling material in a space between the electronic components to form a spacing portion. The spacing portion has a first segment and a second segment separated from each other to serve as a stress buffer zone. Therefore, when an encapsulation layer encapsulating the electronic components is subsequently ground, the present disclosure can effectively prevent the electronic components from being cracked due to stresses induced by the external grinding force.
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Patent Agency Ranking
6.发明授权公开(公告)号：US11056442B2
公开(公告)日：2021-07-06
申请号：US15624590
申请日：2017-06-15
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Po-Hao Wang , Chun-Tang Lin , Shou-Qi Chang , Yu-Hsiang Hsieh
IPC: H01L23/00 , H01L23/14 , H01L25/065 , H01L23/498 , H01L23/13 , H01L23/31
Abstract: A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body. The obtuse portion includes a plurality of turning surfaces to disperse the stress of the substrate body generated in the packaging process. Therefore, the substrate body is prevented from being cracked. A method for fabricating the substrate structure and an electronic package including the substrate structure are also provided.
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公开(公告)号：US20200350261A1
公开(公告)日：2020-11-05
申请号：US16875240
申请日：2020-05-15
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Po-Hao Wang , Chang-Fu Lin , Chun-Tang Lin , Bo-Hao Chang
IPC: H01L23/00 , H01L23/31 , H01L23/498
Abstract: Provided is a substrate structure, including a substrate having at least one chamfer formed on a surface thereof, and a plurality of conductive bodies formed to the substrate. Therefore, a stress generated during the packaging process is alleviated through the chamfer, and the substrate structure is prevented from being cracked. An electronic package employing the substrate structure is also provided.
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公开(公告)号：US20170309579A1
公开(公告)日：2017-10-26
申请号：US15494034
申请日：2017-04-21
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Po-Hao Wang , Chang-Fu Lin , Chun-Tang Lin , Bo-Hao Chang
IPC: H01L23/00 , H01L23/498 , H01L23/31
Abstract: Provided is a substrate structure, including a substrate having at least one chamfer formed on a surface thereof, and a plurality of conductive bodies formed to the substrate. Therefore, a stress generated during the packaging process is alleviated through the chamfer, and the substrate structure is prevented from being cracked. An electronic package employing the substrate structure is also provided.
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公开(公告)号：US11227842B2
公开(公告)日：2022-01-18
申请号：US16875240
申请日：2020-05-15
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Po-Hao Wang , Chang-Fu Lin , Chun-Tang Lin , Bo-Hao Chang
IPC: H01L23/00 , H01L23/498 , H01L23/31
Abstract: Provided is a substrate structure, including a substrate having at least one chamfer formed on a surface thereof, and a plurality of conductive bodies formed to the substrate. Therefore, a stress generated during the packaging process is alleviated through the chamfer, and the substrate structure is prevented from being cracked. An electronic package employing the substrate structure is also provided.
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公开(公告)号：US10763223B2
公开(公告)日：2020-09-01
申请号：US15494034
申请日：2017-04-21
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Po-Hao Wang , Chang-Fu Lin , Chun-Tang Lin , Bo-Hao Chang
IPC: H01L23/00 , H01L23/31 , H01L23/498
Abstract: Provided is a substrate structure, including a substrate having at least one chamfer formed on a surface thereof, and a plurality of conductive bodies formed to the substrate. Therefore, a stress generated during the packaging process is alleviated through the chamfer, and the substrate structure is prevented from being cracked. An electronic package employing the substrate structure is also provided.
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