- 专利标题： Chip package array, and chip package
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申请号： US15636644申请日： 2017-06-29
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公开(公告)号： US11227848B2公开(公告)日： 2022-01-18
- 发明人: Wen-Yuan Chang , Wei-Cheng Chen , Hsueh-Chung Shelton Lu
- 申请人： VIA Alliance Semiconductor Co., Ltd.
- 申请人地址： CN Shanghai
- 专利权人： VIA Alliance Semiconductor Co., Ltd.
- 当前专利权人： VIA Alliance Semiconductor Co., Ltd.
- 当前专利权人地址： CN Shanghai
- 代理机构： JCIPRNET
- 优先权： TW106115539 20170511
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/00 ; H01L21/56 ; H01L25/04 ; H01L23/31 ; H01L27/00
摘要：
A chip package array including a plurality of chip packages is provided. The chip packages are suitable for array arrangement to form the chip package array. Each of the chip packages includes a redistribution structure, a supporting structure, a chip, and an encapsulated material. The supporting structure is disposed on the redistribution structure and has an opening. The chip is disposed on the redistribution structure and located in the opening. The encapsulated material is located between the opening and the chip, wherein the encapsulated material is filled between the opening and the chip, and the chip and the supporting structure are respectively connected to the redistribution structure.
公开/授权文献
- US20180061788A1 CHIP PACKAGE ARRAY, AND CHIP PACKAGE 公开/授权日：2018-03-01
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