Invention Grant
- Patent Title: Antenna package and configuration for millimeter wave
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Application No.: US16004466Application Date: 2018-06-11
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Publication No.: US11228086B2Publication Date: 2022-01-18
- Inventor: Jon Lasiter , Ravindra Vaman Shenoy , Mohammad Ali Tassoudji , Seong Heon Jeong , Jeremy Darren Dunworth
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q21/06 ; H01L23/66 ; H01Q9/06

Abstract:
An antenna package comprising a chip package including a plurality of feed lines, a first half antenna subassembly electrically coupled to the feed lines, and a second half antenna subassembly electrically coupled to the feed lines, wherein the first and second half antenna subassemblies point away from each other in a direction substantially perpendicular to the chip package. The antenna subassemblies may be millimeter (mm) wave antennas covering from approximately 24 to 43.5 GHz. The antenna subassemblies include a flex substrate formed from printed circuit boards (PCB) or flex-film PCB.
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