Invention Grant
- Patent Title: Semiconductor device package
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Application No.: US16785289Application Date: 2020-02-07
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Publication No.: US11228088B2Publication Date: 2022-01-18
- Inventor: Hung-Hsiang Cheng
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01L23/66 ; H01Q1/40 ; H01L23/498
Abstract:
The present disclosure relates to a semiconductor device package. The semiconductor device package includes an antenna layer having a feeding region and an insulating layer disposed on the antenna layer. The insulating layer has a first portion in contact with the antenna layer and a second portion on the first portion. The first portion and the second portion of the insulating layer define a stepped structure exposing the feeding region of the antenna layer. A method of manufacturing a semiconductor device package is also disclosed.
Public/Granted literature
- US20210249756A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-08-12
Information query
