公开(公告)号：US11316249B2

公开(公告)日：2022-04-26

申请号：US16806460

申请日：2020-03-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hung-Hsiang Cheng

IPC: H01L23/538 ,  H01Q1/22 ,  H01L23/31 ,  H01L23/66 ,  H01L23/552 ,  H01L21/683 ,  H01L25/065

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first substrate having a first surface and a second surface opposite to the first surface, an antenna module disposed on the first surface of the first substrate, an electronic component module disposed on the first surface of the first substrate, and a first package body encapsulating the antenna module and the electronic component module. The antenna module has a first surface facing the first surface of the first substrate, a second surface opposite to the first surface of the antenna module, and a lateral surface extending between the first surface of the antenna module and the second surface of the antenna module. The lateral surface of the antenna module faces the electronic component module. A method of manufacturing a semiconductor device package is also provided.

公开(公告)号：US11228088B2

公开(公告)日：2022-01-18

申请号：US16785289

申请日：2020-02-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hung-Hsiang Cheng

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q1/40 ,  H01L23/498

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes an antenna layer having a feeding region and an insulating layer disposed on the antenna layer. The insulating layer has a first portion in contact with the antenna layer and a second portion on the first portion. The first portion and the second portion of the insulating layer define a stepped structure exposing the feeding region of the antenna layer. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US11670836B2

公开(公告)日：2023-06-06

申请号：US17084487

申请日：2020-10-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ting Ruei Chen ,  Hung-Hsiang Cheng ,  Guo-Cheng Liao ,  Yun-Hsiang Tien

IPC: H01Q1/22 ,  H01Q1/36 ,  H01L23/66 ,  H01L23/538 ,  H01Q19/10

CPC classification number: H01Q1/2283 ,  H01L23/5385 ,  H01L23/66 ,  H01Q1/36 ,  H01Q19/104 ,  H01L2924/1421

Abstract: A semiconductor device package includes a substrate, an air cavity, a radiator, and a director. The substrate has a top surface. The air cavity is disposed within the substrate. The air cavity has a first sidewall and a second sidewall opposite to the first sidewall. The radiator is disposed adjacent to the first sidewall of the air cavity. The director is disposed adjacent to the second sidewall of the air cavity.