Invention Grant
- Patent Title: Resin composition, cured product and laminate
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Application No.: US16754922Application Date: 2018-11-20
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Publication No.: US11230633B2Publication Date: 2022-01-25
- Inventor: Kenichirou Oka , Hideki Torii , Yasuhiro Takada
- Applicant: DIC Corporation
- Applicant Address: JP Tokyo
- Assignee: DIC Corporation
- Current Assignee: DIC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JPJP2017-242791 20171219,JPJP2018-078374 20180416
- International Application: PCT/JP2018/042785 WO 20181120
- International Announcement: WO2019/123942 WO 20190627
- Main IPC: C08K5/3492
- IPC: C08K5/3492 ; C09D7/48 ; C09D133/14
Abstract:
The present invention discloses a resin composition containing an isocyanurate ring-containing urethane (meth)acrylate compound A, an isocyanurate ring-containing tri(meth)acrylate compound B, and a triazine ultraviolet light absorber C, wherein the isocyanurate ring-containing urethane (meth)acrylate compound A contains a compound A-1 having a specific structure, and the isocyanurate ring-containing tri(meth)acrylate compound B contains a compound B-1 having a specific structure.
Public/Granted literature
- US20200263002A1 RESIN COMPOSITION, CURED PRODUCT AND LAMINATE Public/Granted day:2020-08-20
Information query
