Invention Grant
- Patent Title: Heat dissipation assembly
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Application No.: US16820662Application Date: 2020-03-16
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Publication No.: US11236948B2Publication Date: 2022-02-01
- Inventor: Wei-Fang Wu , Li-Kuang Tan
- Applicant: DELTA ELECTRONICS, INC.
- Applicant Address: TW Taoyuan
- Assignee: DELTA ELECTRONICS, INC.
- Current Assignee: DELTA ELECTRONICS, INC.
- Current Assignee Address: TW Taoyuan
- Agency: CKC & Partners Co., LLC
- Priority: CN201610714849.4 20160824
- Main IPC: F28D15/02
- IPC: F28D15/02 ; F28D15/04 ; H05K7/20

Abstract:
A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.
Public/Granted literature
- US20200217595A1 HEAT DISSIPATION ASSEMBLY Public/Granted day:2020-07-09
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