Invention Grant
- Patent Title: Comolded non-destructive inspection standard functioning as a bond bump
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Application No.: US16690639Application Date: 2019-11-21
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Publication No.: US11237133B2Publication Date: 2022-02-01
- Inventor: David R. Lyders , Andrew Pope , Christopher Avery , Daniel A. Rodrigues
- Applicant: United Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Farmington
- Agency: Bachman & LaPointe, P.C.
- Main IPC: G01N29/11
- IPC: G01N29/11 ; G01N29/30 ; G01N21/86 ; G01N23/083 ; G01N23/046
Abstract:
An inspection feature for an adhesive bond portion between parts of a component comprising the inspection feature extending from a surface of the part of the component a predetermined bond line thickness, the inspection feature having a density configured to imitate a defect of the adhesive bond portion responsive to a non-destructive inspection scan.
Public/Granted literature
- US20210156825A1 COMOLDED NON-DESTRUCTIVE INSPECTION STANDARD FUNCTIONING AS A BOND BUMP Public/Granted day:2021-05-27
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