- Patent Title: Semiconductor device and semiconductor package including the same
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Application No.: US16922163Application Date: 2020-07-07
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Publication No.: US11239171B2Publication Date: 2022-02-01
- Inventor: Yeongkwon Ko , Jaeeun Lee , Junyeong Heo
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2019-0141313 20191107
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/02 ; H01L21/764 ; H01L29/417 ; H01L21/762 ; H01L27/088 ; H01L23/538 ; H01L25/065
Abstract:
A semiconductor device includes a semiconductor substrate having a first surface and a second surface opposing each other, a plurality of semiconductor elements disposed on the first surface in a device region, an insulating protective layer, and a connection pad. The second surface is divided into a first region overlapping the device region, and a second region surrounding the first region. The insulating protective layer is disposed on the second surface of the semiconductor substrate, and includes an edge pattern positioned in the second region. The edge pattern includes a thinner portion having a thickness smaller than a thickness of a center portion of the insulating protective layer positioned in the first region and/or an open region exposing the second surface of the semiconductor substrate. The connection pad is disposed on the center portion of the insulating protective layer and is electrically connected to the semiconductor elements.
Public/Granted literature
- US20210143102A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME Public/Granted day:2021-05-13
Information query
IPC分类:
