Invention Grant
- Patent Title: Integrated circuit structure with niobium-based silicide layer and methods to form same
-
Application No.: US16788922Application Date: 2020-02-12
-
Publication No.: US11239336B2Publication Date: 2022-02-01
- Inventor: Wei Hong , Yanping Shen , Domingo A. Ferrer , Hong Yu
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Hoffman Warnick LLC
- Main IPC: H01L29/45
- IPC: H01L29/45 ; H01L29/417 ; H01L29/66 ; H01L29/08 ; H01L27/088 ; H01L29/165 ; H01L29/78 ; H01L21/285

Abstract:
Embodiments of the disclosure provide an integrated circuit (IC) structure with a niobium-based silicide layer. An IC structure according to the disclosure includes a transistor on a substrate, the transistor including a gate structure above the substrate and a source/drain (S/D) region on the substrate adjacent the gate structure. A niobium-based silicide layer is on at least an upper surface the S/D region of the transistor, and extends across substantially an entire width of the S/D region. An S/D contact to the S/D region is in contact with the niobium-based silicide layer.
Public/Granted literature
- US20210249518A1 INTEGRATED CIRCUIT STRUCTURE WITH NIOBIUM-BASED SILICIDE LAYER AND METHODS TO FORM SAME Public/Granted day:2021-08-12
Information query
IPC分类: