Invention Grant
- Patent Title: Module with high peak bandwidth I/O channels
-
Application No.: US16432691Application Date: 2019-06-05
-
Publication No.: US11239922B2Publication Date: 2022-02-01
- Inventor: L. Pierre de Rochemont
- Applicant: L. Pierre de Rochemont
- Applicant Address: US NC Raleigh
- Assignee: L. Pierre de Rochemont
- Current Assignee: L. Pierre de Rochemont
- Current Assignee Address: US NC Raleigh
- Agency: Burns & Levinson, LLP
- Agent Jerry Cohen
- Main IPC: H04B10/69
- IPC: H04B10/69 ; H01L21/48 ; H01L23/528 ; H01L23/538 ; H01L23/66 ; H03H3/00 ; H03H7/06 ; H03H11/42 ; H04L7/00 ; H04Q11/00 ; H03H7/52 ; H01L25/11
Abstract:
A high peak bandwidth I/O channel embedded within a multilayer surface interface that forms the bus circuitry electrically interfacing the output or input port on a first semiconductor die with the input or output port on a second semiconductor die.
Public/Granted literature
- US20200092014A1 MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS Public/Granted day:2020-03-19
Information query
