- 专利标题： Plating method, bubble ejection member, plating apparatus, and device
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申请号： US16757109申请日： 2018-10-17
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公开(公告)号： US11242610B2公开(公告)日： 2022-02-08
- 发明人: Yoko Yamanishi , Yudai Fukuyama , Keita Ichikawa
- 申请人： KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
- 申请人地址： JP Fukuoka
- 专利权人： KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
- 当前专利权人： KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
- 当前专利权人地址： JP Fukuoka
- 代理机构： McDermott Will & Emery LLP
- 优先权： JPJP2017-202994 20171019
- 国际申请： PCT/JP2018/038580 WO 20181017
- 国际公布： WO2019/078229 WO 20190425
- 主分类号： C23C18/16
- IPC分类号： C23C18/16 ; B05B17/06 ; C25D5/00
摘要：
A method that can plate a predetermined position on various plating targets without implementing a pretreatment thereon is provided. A plating method is performed on a plating target using a plating solution, and the plating method includes at least a bubble ejection step of ejecting a bubble generated by a bubble ejection member to a plating solution. The bubble ejection member includes an electrode formed of a conductive material and an insulating material covering at least a part of the electrode, at least a part of the insulating material forms a bubble ejection port, and an air gap surrounded by the insulating material is formed between at least a part of the electrode and the bubble ejection port.
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