Invention Grant
- Patent Title: Socket for electrical component
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Application No.: US16957578Application Date: 2018-12-13
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Publication No.: US11244882B2Publication Date: 2022-02-08
- Inventor: Osamu Hachuda
- Applicant: ENPLAS CORPORATION
- Applicant Address: JP Kawaguchi
- Assignee: ENPLAS CORPORATION
- Current Assignee: ENPLAS CORPORATION
- Current Assignee Address: JP Kawaguchi
- Agency: Staas & Halsey, LLP
- Priority: JPJP2017-252363 20171227
- International Application: PCT/JP2018/045843 WO 20181213
- International Announcement: WO2019/131170 WO 20190704
- Main IPC: H01R33/97
- IPC: H01R33/97 ; H01L23/32 ; G01R1/04 ; H01R13/639 ; H01R33/76

Abstract:
To provide a socket for electrical component that allows an electrical component to be easily accommodated and to be able to be accommodated and be used even if the electrical component is large. The IC socket 10 comprises a socket body 13 accommodating an IC package 11; a cover member 15 for pressing the IC package 11; and a lever member 17 for pressing the cover member 15. The cover member 15 and the lever member 17 are rotatably connected to the same side end side of the socket body 13, and a pressing means 25, for pushing down the cover member 15 by closing the lever member 17 at the state that the cover member 15 is closed, is provided.
Public/Granted literature
- US20200321260A1 Socket for Electrical Component Public/Granted day:2020-10-08
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