Invention Grant
- Patent Title: Low-dispersion component in an electronic chip
-
Application No.: US16033109Application Date: 2018-07-11
-
Publication No.: US11244893B2Publication Date: 2022-02-08
- Inventor: François Tailliet , Guilhem Bouton
- Applicant: STMICROELECTRONICS (ROUSSET) SAS
- Applicant Address: FR Rousset
- Assignee: STMICROELECTRONICS (ROUSSET) SAS
- Current Assignee: STMICROELECTRONICS (ROUSSET) SAS
- Current Assignee Address: FR Rousset
- Agency: Seed IP Law Group LLP
- Priority: FR1656020 20160628
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L21/66 ; H01L21/768 ; H01L23/528 ; H01L27/02 ; H01L49/02
Abstract:
A method of manufacturing electronic chips containing low-dispersion components, including the steps of: mapping the average dispersion of said components according to their position in test semiconductor wafers; associating, with each component of each chip, auxiliary correction elements; activating by masking the connection of the correction elements to each component according to the initial mapping.
Public/Granted literature
- US20180323141A1 LOW-DISPERSION COMPONENT IN AN ELECTRONIC CHIP Public/Granted day:2018-11-08
Information query
IPC分类:
