Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16836456Application Date: 2020-03-31
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Publication No.: US11245031B2Publication Date: 2022-02-08
- Inventor: Yasuyuki Hoshi
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Rabin & Berdo, P.C.
- Priority: JPJP2019-091726 20190514
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/10 ; H01L29/06 ; H01L23/00 ; G01R19/165 ; H01L29/66 ; H01L27/02

Abstract:
A region of a portion directly beneath an OC pad is a sensing effective region in which unit cells of a current sensing portion are disposed. A p-type low-dose region is provided on a front surface of a semiconductor substrate and surrounds a periphery of the sensing effective region. The p-type low-dose region is fixed at an electric potential of a source pad of a main semiconductor element. The p-type low-dose region is disposed to be separated from a p-type base region of the sensing effective region by an n−-type region between the p-type low-dose region and the sensing effective region. A total dose of impurities in the p-type low-dose region is lower than a total dose of impurities in a p-type region of a front side of a semiconductor substrate in a main effective region in which unit cells of the main semiconductor element are disposed.
Information query
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