Invention Grant
- Patent Title: Assembly and method for sealing a bundle of wires
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Application No.: US16046577Application Date: 2018-07-26
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Publication No.: US11257612B2Publication Date: 2022-02-22
- Inventor: Sunny Sethi , Vijay Daga , Kavitha Bharadwaj , Ting Gao
- Applicant: TE Connectivity Corporation
- Applicant Address: US PA Berwyn
- Assignee: TE Connectivity Corporation
- Current Assignee: TE Connectivity Corporation
- Current Assignee Address: US PA Berwyn
- Agency: Saxton & Stump LLC
- Main IPC: H01B7/285
- IPC: H01B7/285 ; H01B13/00 ; H01B3/30 ; H01B3/44 ; H02G15/013

Abstract:
A method for sealing a bundle of wires includes providing an adhesive material having a viscosity of less than about 300 Pa·s at the installation temperature. The method further includes forming a structure from the adhesive and inserting a plurality of wires into the structure. A first amount of heat is applied to the structure in a first heating operation. The first amount of heat being higher than an ambient temperature and lower than a softening temperature of the structure. Subsequently, a second amount of heat is applied in a second heating operation to the adhesive structure to thereby fully melt the adhesive structure and cause the adhesive of the structure to fill voids between the plurality of wires to thereby seal the wires. Application of the first amount of heat during the first operation to the structure facilitates improved melt uniformity of the structure during the second heating operation.
Public/Granted literature
- US20200035383A1 ASSEMBLY AND METHOD FOR SEALING A BUNDLE OF WIRES Public/Granted day:2020-01-30
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