Invention Grant
- Patent Title: Multilayered electronic component and board having the same mounted thereon
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Application No.: US16912025Application Date: 2020-06-25
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Publication No.: US11257623B2Publication Date: 2022-02-22
- Inventor: Hyun Tae Kim , Beom Seock Oh , Tai Won Choi , Woo Soon Whang , Byoung Woo Kim , Yong Won Seo
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2020-0005276 20200115,KR10-2020-0073857 20200617
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H05K1/18 ; H01G4/30

Abstract:
A multilayer electronic component includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode including an electrode layer disposed on the body and an Sn plating layer disposed on the electrode layer. A thickness of the body is defined as Tb, a thickness of the Sn plating layer is defined as Ts, Tb is 0.22 mm or less, and Ts is 4.5 μm or more.
Public/Granted literature
- US20210217559A1 MULTILAYERED ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON Public/Granted day:2021-07-15
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