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公开(公告)号：US11037727B2
公开(公告)日：2021-06-15
申请号：US16786159
申请日：2020-02-10
发明人： Kyoung Jin Cha , Woo Chul Shin , Seung Heui Lee , Beom Seock Oh
摘要： A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.
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公开(公告)号：US12009150B2
公开(公告)日：2024-06-11
申请号：US18144390
申请日：2023-05-08
发明人： Kyoung Jin Cha , Woo Chul Shin , Seung Heui Lee , Beom Seock Oh
摘要： A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.
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公开(公告)号：US10714262B2
公开(公告)日：2020-07-14
申请号：US16050560
申请日：2018-07-31
发明人： Jeong Ryeol Kim , Hyo Sub Kim , Kyung Ryul Lee , Jun Oh Kim , Beom Seock Oh , Jong Han Kim , Kyoung Jin Cha
摘要： A multilayer capacitor includes: a body including dielectric layers and internal electrodes alternately disposed therein; and external electrodes disposed on the body and connected to the internal electrodes, respectively. Each of the internal electrodes includes a Ni grain, ceramics distributed in the Ni grain, a first coating layer surrounding the Ni grain, and second coating layers surrounding the ceramics.
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公开(公告)号：US11682521B2
公开(公告)日：2023-06-20
申请号：US17886732
申请日：2022-08-12
发明人： Kyoung Jin Cha , Woo Chul Shin , Seung Heui Lee , Beom Seock Oh
摘要： A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.
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公开(公告)号：US11189423B2
公开(公告)日：2021-11-30
申请号：US16696030
申请日：2019-11-26
发明人： Tae Hoon Kim , Beom Seock Oh , Kyoung Ok Kim , Kwang Sic Kim
摘要： A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, and first to sixth surfaces, the first internal electrode being exposed through the third surface and the fifth surface and the second internal electrode being exposed through the fourth surface and the sixth surface; first and second side portions disposed on the fifth and sixth surfaces, respectively, of the capacitor body; first and second external electrodes; a first step-compensating portion disposed on a margin portion in a width direction on the second dielectric layer on which the second internal electrode is formed on the first internal electrode; and a second step-compensating portion disposed on another margin portion in the width direction on the first dielectric layer on which the first internal electrode is disposed on the second internal electrode.
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公开(公告)号：US11049659B2
公开(公告)日：2021-06-29
申请号：US16281417
申请日：2019-02-21
发明人： Kyoung Jin Cha , Seung Heui Lee , Beom Seock Oh , Kwang Sic Kim , Dong Hoon Kim , Jong Ho Lee , Seon Jae Mun
摘要： Provided are a multilayer ceramic electronic component and a method for manufacturing the same, the multilayer ceramic electronic component including a ceramic body including a dielectric layer and an internal electrode, and an external electrode formed on an outer side of the ceramic body and electrically connected to the internal electrode, wherein the internal electrode includes a conductive metal and an additive, and the number of particles of the additive disposed per μm2 of the internal electrode is in the range of 7 to 21, both inclusive.
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公开(公告)号：US10943736B2
公开(公告)日：2021-03-09
申请号：US16374000
申请日：2019-04-03
发明人： Seung Ho Lee , Jae Yeol Choi , Ki Pyo Hong , Beom Seock Oh
摘要： A method of manufacturing a multilayer ceramic electronic component which includes preparing first and second ceramic green sheets; forming an internal electrode pattern on the first ceramic green sheet using a conductive metal paste; forming a ceramic member on first and second end portions of a first surface of the second ceramic green sheet to form a step portion absorption layer; stacking two or more of the first ceramic green sheets on each other in a stacking direction to form a first group; stacking two or more of the first ceramic green sheets on each other in the stacking direction to form a second group; and placing the second ceramic green sheet between the first group and the second group in the stacking direction to form a ceramic body, wherein the first and second end portions oppose each other in a first direction perpendicular to the stacking direction.
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公开(公告)号：US11862401B2
公开(公告)日：2024-01-02
申请号：US18133218
申请日：2023-04-11
发明人： Tae Hoon Kim , Beom Seock Oh , Kyoung Ok Kim , Kwang Sic Kim
摘要： A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, and first to sixth surfaces, the first internal electrode being exposed through the third surface and the fifth surface and the second internal electrode being exposed through the fourth surface and the sixth surface; first and second side portions disposed on the fifth and sixth surfaces, respectively, of the capacitor body; first and second external electrodes; a first step-compensating portion disposed on a margin portion in a width direction on the second dielectric layer on which the second internal electrode is formed on the first internal electrode; and a second step-compensating portion disposed on another margin portion in the width direction on the first dielectric layer on which the first internal electrode is disposed on the second internal electrode.
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公开(公告)号：US11651898B2
公开(公告)日：2023-05-16
申请号：US17512131
申请日：2021-10-27
发明人： Tae Hoon Kim , Beom Seock Oh , Kyoung Ok Kim , Kwang Sic Kim
摘要： A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, and first to sixth surfaces, the first internal electrode being exposed through the third surface and the fifth surface and the second internal electrode being exposed through the fourth surface and the sixth surface; first and second side portions disposed on the fifth and sixth surfaces, respectively, of the capacitor body; first and second external electrodes; a first step-compensating portion disposed on a margin portion in a width direction on the second dielectric layer on which the second internal electrode is formed on the first internal electrode; and a second step-compensating portion disposed on another margin portion in the width direction on the first dielectric layer on which the first internal electrode is disposed on the second internal electrode.
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公开(公告)号：US20210217559A1
公开(公告)日：2021-07-15
申请号：US16912025
申请日：2020-06-25
发明人： Hyun Tae Kim , Beom Seock Oh , Tai Won Choi , Woo Soon Whang , Byoung Woo Kim , Yong Won Seo
摘要： A multilayer electronic component includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode including an electrode layer disposed on the body and an Sn plating layer disposed on the electrode layer. A thickness of the body is defined as Tb, a thickness of the Sn plating layer is defined as Ts, Tb is 0.22 mm or less, and Ts is 4.5 μm or more.
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