- 专利标题: Separators for handling, transporting, or storing semiconductor wafers
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申请号: US16116847申请日: 2018-08-29
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公开(公告)号: US11257700B2公开(公告)日: 2022-02-22
- 发明人: Sunna Chung , Ryan Park , Jin Chae , Matthew Whitlock , Jonathan Lie , Athens Okoren
- 申请人: Daewon Semiconductor Packaging Industrial Company
- 申请人地址: US CA Santa Clara
- 专利权人: Daewon Semiconductor Packaging Industrial Company
- 当前专利权人: Daewon Semiconductor Packaging Industrial Company
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Perkins Coie LLP
- 代理商 Brian Coleman; Andrew T. Pettit
- 主分类号: B65D85/48
- IPC分类号: B65D85/48 ; H01L21/673
摘要:
Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.
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